Introduction to the applic不為ation of PI fil紅聽m in the manufac紙愛turing of flexible copper腦都 laminates

Release Time：

2023-06-06

Source：

The largest application ar如熱ea for polyimide (PI)少一 films today is flexographic pr近知inted circuit boards. Wit樂場h the rapid dev空身elopment of electronic pr計雪oducts, the ele通短ctronic assembly tec家師hnology has put forward on門喝e serious challenge a下風fter another. In order to meet 舞什the development of electronics t綠一echnology, bold innovations i又線n electronic assembly t他科echnology have been made, and in this c鐵會ontext a flexible子上 circuit (flex 紙雪circuit) containing delicate wire外信s and manufactured with 務紅thin, flexible p風東olymer films has been cr人區eated, which can be a歌視pplied to surface mount techn司長ology and can be bent短了 into numerous desired shapes.

Flexible circuit boards (FPCs) u筆下sing SMT technology 商見can be manufactured very拿事 thin and compact, w行靜ith insulation thicknesses of less tha兵校n 25 μm. These flexibl他人e circuits can be bent at wi體視ll and can be rolled and placed into a刀笑 cylinder to make full use of the拿是 three-dimensional volume. 畫睡It breaks the conventional stereot鄉離ype of the inherent use of area, t了相hus creating the ab愛數ility to take full advan區時tage of the volu些問me shape, which can significan東少tly increase the effecti愛還ve use density in terms of the leng鐵鐵th of conductors used per unit光站 area, which is木到 currently used routine店哥ly, to form a h票不igh-density asse訊少mbly form. The use of flexible circuits也他 has expanded in信低 recent years to include radio communic地畫ations, computers, and automotive elec議靜tronics. Previously used exclusively as醫畫 an alternative to rigid cabl唱從es, flex circuits are 學放well established a也拿s a substitute for rigid 著輛circuits and printed circuit 作喝boards in applications媽會 requiring thin商懂 or three-dimensional circ海用uits. In order to meet th空的e requirements of rigid-月什flex applications, ri市黑gid-flex technolo年拿gy combines flex公暗 circuits (i.e., rigid-flex p東做rinted circuit boards) with rigid c靜銀ircuit boards.

The main materials used i低兵n general flex circuits (3-laye樂車r method of FPC) are insulating film (i喝動nsulation layer),校費 adhesive, and wires (conductive lay輛車er). The insulating film forms the這音 base of the circui會兒t and constitutes the insul綠我ation layer of the fl光話exible circuit substrate. 慢懂The adhesive bonds the copper 用爸foil to the insul些做ating booklet film, and 錢個in the multilayer stru山吧cture design, a numb書她er of internal layer但器s are bonded together. An oute遠車r protective layer (cover film) 農請is used to isolate the elec城數tricity from dust and moisture, a日房nd at the same time 門線to reduce the stress during flexing. Th南雜e conductive layer is provided by a公生 copper foil. In some flex circuits, r什開einforcing plates (made弟討 of aluminum, stainless steel, compo問小site materials, etc.) are used as rein子店forcing ribs to ensur房票e geometric stability. It also provid唱街es mechanical support during 空我component and connector inserti家資on, as well as stress relief.
 

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